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首页> 外文期刊>IEEE Transactions on Electron Devices >Electron drift mobility model for devices based on unstrained and coherently strained Si/sub 1-x/Ge/sub x/ grown on >001< silicon substrate
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Electron drift mobility model for devices based on unstrained and coherently strained Si/sub 1-x/Ge/sub x/ grown on >001< silicon substrate

机译:基于> 001 <硅衬底上生长的未应变和相干应变的Si / sub 1-x / Ge / sub x /的器件的电子漂移迁移率模型

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摘要

The electron drift mobility for unstrained and coherently strained Si/sub 1-x/Ge/sub x/ grown on a >001< silicon substrate is analytically obtained for Ge fractions less than 30%. The method is based on the following two assumptions: the conduction bands of the unstrained alloy are Si-like for Ge fraction less than 30%, and in the case of the coherently strained alloy, strain-induced energy shifts occur in the conduction band valleys. The shifts in energy yield two different mobility values: one corresponding to the growth plane with a value larger than the unstrained mobility, and the other parallel to the growth direction and correspondingly smaller in value. In comparison to silicon, the results show a degradation of both the unstrained mobilities for doping levels up to 10/sup 17/ cm/sup -3/. Beyond this doping level, the strained mobility component parallel to the growth direction becomes slightly larger than the mobility of silicon.
机译:对于小于30%的Ge分数,可以通过分析获得在> 001 <硅衬底上生长的未应变和相干应变的Si / sub 1-x / Ge / sub x /的电子漂移迁移率。该方法基于以下两个假设:Ge含量小于30%时,未应变合金的导带呈Si状;在相干应变合金的情况下,应变引起的能移发生在导带谷中。能量的移动产生两个不同的迁移率值:一个对应于具有比未应变迁移率大的值的生长平面,另一个与生长方向平行并且相应地更小值。与硅相比,结果表明掺杂水平最高为10 / sup 17 / cm / sup -3 /时,两种非应变迁移率都下降了。超过该掺杂水平,平行于生长方向的应变迁移率分量变得略大于硅的迁移率。

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