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A physically based compact device model for fully depleted and nearly fully depleted SOI MOSFET

机译:基于物理的紧凑型器件模型,用于完全耗尽和几乎完全耗尽的SOI MOSFET

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摘要

A compact submicrometer Fully Depleted Silicon-On-Insulator (FDSOI) and Nearly FDSOI MOSFET device model suitable for analog as well as digital application has been proposed. It is an all region model. In developing this model care has been taken in retaining the basic functional form of physical models while improving the model accuracy and computational efficiency. In addition to the commonly included effects in the FDSOI MOSFET model, we have given careful consideration to parasitic source/drain resistance, Drain Induced Conductivity Enhancement (DICE) effect, floating body effect, self-heating and model continuity. A single parameter set is used for a large set of device dimensions except threshold voltage and parasitic source/drain resistance due to silicon film thickness variations. The accuracy of the model is validated with experimental data using NMOS FDSOI devices and found to be in good agreement.
机译:已经提出了一种适用于模拟和数字应用的紧凑型亚微米全耗尽型绝缘体上硅(FDSOI)和近FDSOI MOSFET器件模型。这是一个全区域模型。在开发此模型时,在保留物理模型的基本功能形式的同时要注意提高模型的准确性和计算效率。除了FDSOI MOSFET模型中通常包含的效应外,我们还仔细考虑了寄生源极/漏极电阻,漏极感应电导率增强(DICE)效应,浮体效应,自热和模型连续性。单个参数集用于大量设备尺寸,但阈值电压和由于硅膜厚度变化引起的寄生源极/漏极电阻除外。使用NMOS FDSOI器件通过实验数据验证了模型的准确性,并发现一致性良好。

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