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Application of liquid phase deposited silicon dioxide to metal-oxide-semiconductor capacitor and amorphous silicon thin-film transistor

机译:液相沉积二氧化硅在金属氧化物半导体电容器和非晶硅薄膜晶体管中的应用

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Liquid phase deposited silicon dioxide (LPD-SiO/sub 2/) is applied to crystalline Si metal-oxide-semiconductor (MOS) capacitor as the gate insulator. It is demonstrated that slow states exist at the Si/SiO/sub 2/ interface which cause hysteresis in the capacitance-voltage (C-V) characteristics. These slow states can be removed effectively by post-metallization-anneal. By means of C-V measurement and infrared absorption spectroscopy, it is concluded that the slow states are originated from the residual water or hydroxyl molecules in LPD-SiO/sub 2/. The LPD-SiO/sub 2/ is also applied to fabricate amorphous silicon (a-Si:H) thin film transistor (TFT) based on a new self-aligned process. The performance of this device is comparable to those of thin film transistors employed other kinds of SiO/sub 2/, i.e., thermal, plasma, vacuum evaporation, etc., as the gate insulator. The bias-stress measurement shows that the threshold voltage shift is dominated by charge trapping in the gate insulator.
机译:将液相沉积的二氧化硅(LPD-SiO / sub 2 /)应用于晶体硅金属氧化物半导体(MOS)电容器作为栅极绝缘体。结果表明,Si / SiO / sub 2 /界面处存在缓慢状态,这会导致电容-电压(C-V)特性出现滞后。这些慢态可以通过后金属化退火有效地去除。通过C-V测量和红外吸收光谱法得出结论,慢态源自LPD-SiO / sub 2 /中的残留水或羟基分子。 LPD-SiO / sub 2 /还可用于基于新的自对准工艺制造非晶硅(a-Si:H)薄膜晶体管(TFT)。该器件的性能与采用其他种类的SiO / sub 2 /,即热,等离子体,真空蒸发等作为栅绝缘体的薄膜晶体管的性能相当。偏置应力测量表明,阈值电压偏移主要受栅绝缘体中电荷捕获的影响。

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