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Quasi-saturation capacitance behavior of a DMOS device

机译:DMOS器件的准饱和电容行为

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This paper reports a simulation study on the capacitance characteristics of a double-diffused metal-oxide semiconductor (DMOS) device operating in the quasi-saturation region. From the analysis, the capacitance effect of the gate oxide upon the drift region cannot be modeled as an overlap capacitance, because the drain-gate/source-gate capacitances of the DMOS device may exceed the gate-oxide capacitance due to the larger voltage drop over the gate oxide than the change in the imposed gate bias when entering the quasi-saturation region. This effect can be the explanation for the plateau behavior in the gate charge plot during turn-on and turn-off of the DMOS device. Based on the small-signal equivalent capacitance model, the accumulated charge in the drift region below the gate oxide may thoroughly associate with the drain terminal in the prequasi-saturation region and with the source terminal in the quasi-saturation region.
机译:本文对在准饱和区域工作的双扩散金属氧化物半导体(DMOS)器件的电容特性进行了仿真研究。根据分析,栅极氧化物对漂移区的电容效应不能建模为重叠电容,因为由于较大的压降,DMOS器件的漏极-栅极/源极-栅极电容可能会超过栅极氧化物电容。进入准饱和区时,在栅极氧化层上的应力比施加的栅极偏置的变化要大。这种效应可以解释DMOS器件导通和关断期间栅极电荷图中的平稳行为。基于小信号等效电容模型,栅极氧化物下方漂移区中的累积电荷可能会与准饱和区域中的漏极端子和准饱和区域中的源极端子完全关联。

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