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Steady-state and transient forward current-voltage characteristics of 4H-silicon carbide 5.5 kV diodes at high and superhigh current densities

机译:高和超高电流密度下4H碳化硅5.5 kV二极管的稳态和瞬态正向电流-电压特性

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Steady-state and transient forward current-voltage I-V characteristics have been measured in 5.5 kV p/sup +/-n-n/sup +/ 4H-SiC rectifier diodes up to a current density j/spl ap/5.5/spl times/10/sup 4/ A/cm/sup 2/. The steady-state data are compared with calculations in the framework of a model, in which the emitter injection coefficient decreases with increasing current density. To compare correctly the experimental and theoretical results, the lifetime of minority carriers for high injection level, /spl tau//sub ph/, has been estimated from transient characteristics. At low injection level, the hole diffusion length L/sub pl/ has been measured by photoresponse technique. For a low-doped n-base, the hole diffusion lengths are L/sub pl//spl ap/2 /spl mu/m and L/sub ph//spl ap/6-10 /spl mu/m at low and high injection levels respectively. Hole lifetimes for low and high injection levels are /spl tau//sub pl//spl ap/15 ns and /spl tau//sub ph//spl ap/140-400 ns. The calculated and experimental results agree well within the wide range of current densities 10 A/cm/sup 2/>j> 4/spl times/10/sup 3/ A/cm/sup 2/. At j<5 kA/cm/sup 2/, the experimental values of residual voltage drop V is lower than the calculated ones. In the range of current densities 5/spl times/10/sup 3/ A/cm/sup 2/>j>2/spl times/10/sup 4/ A/cm/sup 2/, the minimal value of differential resistance R/sub d/=dV/dj is 1.5/spl times/10/sup -4/ /spl Omega/ cm/sup 2/. At j<25 kA/cm/sup 2/, R/sub d/ increases with increasing current density manifesting the contribution of other nonlinear mechanisms to the formation steady-state current-voltage characteristic. The possible role of Auger recombination is also discussed.
机译:在5.5 kV p / sup +/- nn / sup + / 4H-SiC整流二极管中测量了稳态和瞬态正向电流-电压IV特性,电流密度为j / spl ap / 5.5 / spl次/ 10 / sup 4 / A / cm / sup 2 /。将稳态数据与模型框架中的计算进行比较,其中,发射极注入系数随电流密度的增加而降低。为了正确比较实验结果和理论结果,从瞬态特性中估算了高注入水平/ spl tau // sub ph /下少数载流子的寿命。在低注入水平下,已经通过光响应技术测量了空穴扩散长度L / subpl /。对于低掺杂n基极,在低和低时,空穴扩散长度为L / sub pl // spl ap / 2 / spl mu / m和L / sub ph // spl ap / 6-10 / spl mu / m高注射水平。高低注入量的孔寿命为/ spl tau // sub pl // spl ap / 15 ns和/ spl tau // sub ph // spl ap / 140-400 ns。在电流密度10 A / cm / sup 2 /> j> 4 / spl次/ 10 / sup 3 / A / cm / sup 2 /的大电流密度范围内,计算结果和实验结果完全吻合。在j <5 kA / cm / sup 2 /时,残余电压降V的实验值低于计算值。在电流密度范围5 / spl次/ 10 / sup 3 / A / cm / sup 2 /> j> 2 / spl次/ 10 / sup 4 / A / cm / sup 2 /中,差动电阻的最小值R / sub d / = dV / dj为1.5 / spl乘以10 / sup -4 / / splΩ/ cm / sup 2 /。在j <25 kA / cm / sup 2 /时,R / sub d /随着电流密度的增加而增加,这表明其他非线性机制对地层稳态电流-电压特性的贡献。还讨论了俄歇重组的可能作用。

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