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A new 'multifrequency' charge pumping technique to profile hot-carrier-induced interface-state density in nMOSFET's

机译:一种新的“多频”电荷泵浦技术,用于分析nMOSFET内热载流子引起的界面态密度

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A new "multifrequency" charge pumping technique is proposed to determine the spatial distribution of interface-state density in nMOSFETs subjected to hot-carrier stress, for situations where negligible charge trapping takes place. It is shown that the increase in charge pumping current with larger gate pulse amplitude is not only due to the increase in charge pumping area, but also due to the increased energy zone of recombination in the band gap. The nonuniformity of interface-state density, spatially near the drain junction and energetically in the band gap scanned by charge pumping also contributes. The resulting uncertainty in the determination of the charge pumping edge using the conventional approach (which neglects the dependence of energy zone of recombination on gate pulse amplitude and assumes spatial uniformity of prestress interface-state density) and hence the error in the extracted post-stress damage profile is pointed out. The new technique uniquely determines the correct charge pumping edge and hence the damage distribution.
机译:提出了一种新的“多频”电荷泵技术,用于确定在发生热载流子陷阱的情况下,nMOSFET中界面态密度的空间分布。结果表明,具有较大栅极脉冲幅度的电荷泵浦电流的增加不仅是由于电荷泵浦面积的增加,而且还由于带隙中复合能量区域的增加。界面态密度的不均匀性,在空间上靠近漏极结,在能量上在通过电荷泵浦扫描的带隙中也有贡献。使用常规方法确定电荷泵浦边沿时产生的不确定性(忽略了重组能量区对栅极脉冲幅度的依赖性,并假定了预应力界面态密度的空间均匀性),因此,提取的后应力存在误差指出损坏情况。新技术可以唯一确定正确的电荷泵送边缘,从而确定损坏的分布。

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