首页> 外文期刊>IEEE Transactions on Electron Devices >The effect of gate recess profile on device performance of Ga/sub 0.51/In/sub 0.49/P/In/sub 0.2/Ga/sub 0.8/As doped-channel FET's
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The effect of gate recess profile on device performance of Ga/sub 0.51/In/sub 0.49/P/In/sub 0.2/Ga/sub 0.8/As doped-channel FET's

机译:栅极凹槽轮廓对Ga / sub 0.51 / In / sub 0.49 / P / In / sub 0.2 / Ga / sub 0.8 / As掺杂沟道FET器件性能的影响

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The effect of gate recess profile on device performance of Ga/sub 0.51/In/sub 0.49/P/In/sub 0.2/Ga/sub 0.8/As doped-channel FETs was studied. In the experiment, Ga/sub 0.51/In/sub 0.49/P/In/sub 0.2/Ga/sub 0.8/As doped-channel FETs (DCFET's) using triple-recessed gate structure were compared with devices using single-recessed and double-recessed gate structures. It is found that triple-recessed gate approach provides higher breakdown voltage (35 V) than single-recessed (16 V) and double-recessed gate (28 V) approaches. This is attributed to the larger aspect ratio in the triple-recessed gate structure. A unified method to calculate the breakdown voltages of MESFETs, HEMTs and DCFETs (or MISFETs) of any given arbitrary recessed gate profile was proposed and used to explain the experimental results.
机译:研究了栅极凹槽轮廓对Ga / sub 0.51 / In / sub 0.49 / P / In / sub 0.2 / Ga / sub 0.8 / As掺杂沟道FET器件性能的影响。在实验中,将使用三凹栅结构的Ga / sub 0.51 / In / sub 0.49 / P / In / sub 0.2 / Ga / sub 0.8 / As掺杂沟道FET(DCFET)与使用单凹和双凹的器件进行了比较-嵌入式门结构。发现三凹栅方式比单凹栅方式(16 V)和双凹栅方式(28 V)提供更高的击穿电压(35 V)。这归因于三凹栅结构中较大的纵横比。提出了一种统一的方法来计算任意给定的凹入栅极轮廓的MESFET,HEMT和DCFET(或MISFET)的击穿电压,并将其用于解释实验结果。

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