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Super thin-film transistor with SOI CMOS performance formed by a novel grain enhancement method

机译:通过新型晶粒增强方法形成的具有SOI CMOS性能的超薄膜晶体管

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摘要

High performance super TFTs with different channel widths and lengths, formed by a novel grain enhancement method, are reported. High temperature annealing has been utilized to enhance the polysilicon grain and improve the quality of silicon crystal after low temperature MILC treatment on amorphous silicon. With device scaling, it is possible to fabricate the entire transistor on a single grain, thus giving the performance of single crystal SOI MOSFET. The effects of grain boundaries on device performance have been studied, indicating the existence of extra leakage current paths caused by the grain boundaries traversing the channel, which induced subthreshold hump and early punchthrough of wide devices. The probability for the channel region of a TFT to cover multiple grains decreases significantly when the device is scaled down, resulting in better device performance and higher uniformity.
机译:报道了通过新颖的晶粒增强方法形成的具有不同沟道宽度和长度的高性能超级TFT。在非晶硅上进行低温MILC处理后,已经利用高温退火来增强多晶硅晶粒并改善硅晶体的质量。通过器件缩放,可以在单个晶粒上制造整个晶体管,从而提供单晶SOI MOSFET的性能。研究了晶界对器件性能的影响,表明存在由晶界横穿沟道引起的额外泄漏电流路径,从而引起宽阈值的峰化和宽器件的早期穿通。当按比例缩小器件尺寸时,TFT的沟道区域覆盖多个晶粒的可能性将大大降低,从而获得更好的器件性能和更高的均匀性。

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