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METHOD TO ENHANCE CMOS TRANSISTOR PERFORMANCE BY INDUCING STRAIN IN THE GATE AND CHANNEL

机译:通过在栅极和通道中引入应变来增强CMOS晶体管性能的方法

摘要

A method of manufacturing complementary metal oxide semiconductor transistors forms different types of transistors such as N-type metal oxide semiconductor (NMOS) transistors and P-type metal oxide semiconductor (PMOS) transistors (first and second type transistors) on a substrate (12). The method forms an optional oxide layer (52) on the NMOS transistors and the PMOS transistors and then covers the NMOS transistors and the PMOS transistors with a hard material (50) such as a silicon nitride layer. Following this, the method patterns portions of the hard material layer (50), such that the hard material layer remains only over the NMOS transistors. Next, the method heats (178, 204) the NMOS transistors and then removes the remaining portions of the hard material layer (50). By creating compressive stress in the gates (22) and tensile stress (70) in the channel regions of the NMOS transistors (NFETs), without creating stress in the gates (20) or channel regions of the PMOS transistors (PFETs), the method improves performance of the NFETs without degrading performance of the PFETs.
机译:制造互补金属氧化物半导体晶体管的方法在衬底(12)上形成不同类型的晶体管,例如N型金属氧化物半导体(NMOS)晶体管和P型金属氧化物半导体(PMOS)晶体管(第一和第二类型晶体管) 。该方法在NMOS晶体管和PMOS晶体管上形成可选的氧化物层(52),然后用诸如氮化硅层的硬质材料(50)覆盖NMOS晶体管和PMOS晶体管。之后,该方法对硬质材料层(50)的部分进行图案化,使得硬质材料层仅保留在NMOS晶体管上方。接下来,该方法加热(178、204)NMOS晶体管,然后去除硬质材料层的剩余部分(50)。通过在NMOS晶体管(NFET)的沟道区中在栅极(22)中产生压应力和拉伸应力(70),而在PMOS晶体管(PFET)的栅极(20)中或沟道区域中不产生应力,该方法改进了NFET的性能,而不会降低PFET的性能。

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