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Use of transient enhanced diffusion to tailor boron out-diffusion

机译:使用瞬态增强扩散来调整硼的向外扩散

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We report experimental results demonstrating the use of transient enhanced diffusion (TED) caused by silicon implant for "tuning" boron out-diffusion. The effect was measured as a function of the silicon implant dose and anneal temperature, and a range of boron junction depth movement from almost none up to 81 nm was observed with increasing TED at 750/spl deg/C. The diffused profiles could be approximated by using a modified solubility limit model to describe the enhanced boron diffusion and clustering. However, by using a more sophisticated continuum model based on atomistic calculations, excellent agreement with the measured profiles could he obtained. In addition, the fit to the measured data yields the fraction of boron present in BI/sub 2/ precursor clusters after silicon implant as a function of the silicon implant dose. Two possible applications of the TED "tuning" are discussed, with device simulations which show that the effect is sufficiently large to tune the base width of a bipolar device from being depleted to that suitable for a high performance device.
机译:我们报告的实验结果证明了使用由硅注入引起的瞬态增强扩散(TED)来“调整”硼的向外扩散。根据硅注入剂量和退火温度来测量效果,并且随着TED在750 / spl deg / C下的增加,观察到硼结深度移动范围几乎从无到81 nm。扩散轮廓可以通过使用修正的溶解度极限模型来描述增强的硼扩散和聚类来近似。但是,通过使用基于原子计算的更复杂的连续谱模型,可以得到与测量轮廓的极佳一致性。另外,对测量数据的拟合得出了在硅注入之后,BI / sub 2 /前驱体簇中存在的硼比例随硅注入剂量的变化而变化。讨论了TED“调谐”的两种可能的应用,并通过器件仿真显示了效果足够大,可以将双极型器件的基极宽度从耗尽状态调整到适合高性能器件的宽度。

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