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首页> 外文期刊>IEEE Transactions on Electron Devices >Experimental evidence of T/sub BD/ power-law for voltage dependence of oxide breakdown in ultrathin gate oxides
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Experimental evidence of T/sub BD/ power-law for voltage dependence of oxide breakdown in ultrathin gate oxides

机译:T / sub BD /幂律与超薄栅氧化物中氧化物击穿电压相关的实验证据

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In this paper, we present experimental evidence on the voltage-dependence of the voltage acceleration factors observed on ultrathin oxides from 5 nm down to /spl sim/1 nm over a wide range of voltages from /spl sim/2 V to 6 V. Two independent experimental approaches, area scaling method and long-term stress, are used to investigate this phenomenon. We show the exponential law with a constant voltage-acceleration factor violates the widely accepted fundamental breakdown property of Poisson random statistics while the voltage-dependent voltage acceleration described by an empirical power-law relation preserves this well-known property. The apparent thickness-dependence of voltage acceleration factors measured in different voltage ranges can be nicely understood and unified with these independent experimental results in the scenario of a voltage-driven breakdown. In the framework of the critical defect density and defect generation rate for charge-to-breakdown, we explore the possible explanation of increasing voltage acceleration factors at reduced voltage by assuming a geometric model for the critical defect density.
机译:在本文中,我们提供了在从/ spl sim / 2 V至6 V的宽电压范围内从5 nm向下至/ spl sim / 1 nm的超薄氧化物上观察到的电压加速因子的电压依赖性的实验证据。两种独立的实验方法,面积缩放方法和长期应力,被用来研究这种现象。我们表明,具有恒定电压加速因子的指数定律违反了泊松随机统计的广泛接受的基本击穿特性,而由经验幂律关系描述的与电压相关的电压加速度保留了这一众所周知的特性。在电压驱动击穿的情况下,可以很好地理解在不同电压范围内测得的电压加速因子的表观厚度依赖性,并将其与这些独立的实验结果结合起来。在用于电荷击穿的临界缺陷密度和缺陷产生速率的框架内,我们通过假设临界缺陷密度的几何模型,探索了在降低的电压下增加电压加速因子的可能解释。

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