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Investigation of Program Saturation in Scaled Interpoly Dielectric Floating-Gate Memory Devices

机译:规模化多晶硅介电浮栅存储器件中程序饱和度的研究

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This paper investigates the program saturation in aggressively scaled interpoly dielectric (IPD) floating-gate (FG) cells for nand application. To describe the program saturation in IPD stacks containing thick suboxides (ges 4 nm) , a simple model was developed, directly yielding the maximum reachable programmed threshold voltage level for a given FG cell geometry. The presented model agrees very well to program saturation measurements carried out on a 48 nm FG nand technology with an IPD composed of SiO2 and Al2O3. By extending the considerations to an arbitrary IPD, this paper represents the first attempt to quantify the IPD current blocking ability required for future scaled FG memory cells.
机译:本文研究了用于nand应用的积极规模化的多晶间介电(IPD)浮栅(FG)单元的程序饱和度。为了描述在包含厚的次氧化物(ges 4 nm)的IPD堆栈中的程序饱和度,开发了一个简单的模型,对于给定的FG单元几何形状,可以直接产生最大可达到的编程阈值电压电平。所提出的模型非常适合在48 nm FG nand技术上使用由SiO2和Al2O3组成的IPD进行饱和测量。通过将考虑因素扩展到任意IPD,本文代表了对量化未来的FG存储单元所需的IPD电流阻断能力进行量化的首次尝试。

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