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Simple Analytical Model of the Thermal Resistance of Resistors in Integrated Circuits

机译:集成电路电阻热阻的简单分析模型

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The value of resistors generally changes with electrical current. For precision analog circuit layout, it is important to predict those resistance variations. For that purpose, we derive for the first time a simple analytic 3-D model to describe thermal resistance and self-heating, which we show as the dominant contribution to resistor nonlinearity for a wide range of resistors. The model shows good agreement with numerical simulations. Measured voltage coefficients of metal and polysilicon resistors can be fit to the model over a wide range of geometries. Finally, we show how thermal resistance can be reduced by placing metal bar structures underneath the resistor and apply the model to quantify the improvement.
机译:电阻的值通常随电流而变化。对于精密模拟电路布局,重要的是预测这些电阻的变化。为此,我们首次得出一个简单的解析3-D模型来描述热阻和自热,我们将其显示为大范围电阻器对电阻器非线性的主要贡献。该模型与数值模拟显示出良好的一致性。金属电阻和多晶硅电阻的测量电压系数可以在各种几何形状上拟合模型。最后,我们展示了如何通过在电阻器下面放置金属条结构来降低热阻,并应用该模型来量化改进。

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