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Performance Variation According to Device Structure and the Source/Drain Metal Electrode of a-IGZO TFTs

机译:根据a-IGZO TFT的器件结构和源极/漏极金属电极的性能差异

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The transmission-line method (TLM) was adopted to clarify the causes of device performance variation according to the source/drain metal electrode and device structure of a thin-film transistor using an amorphous indium–gallium–zinc-oxide channel. Using the TLM, the channel characteristics independent of contact resistance were extracted for the two different contact metals, i.e., Ti and Mo. Based on these results, the mobility characteristics were compared in terms of device scaling and contact structure in the source/drain overlap region. In addition, the transport characteristics according to the contact structure of the source/drain metal electrode were investigated in detail and reproduced using the simulation model.
机译:采用传输线方法(TLM)来根据使用非晶铟-镓-氧化锌沟道的薄膜晶体管的源/漏金属电极和器件结构来阐明器件性能变化的原因。使用TLM,针对两种不同的接触金属(即Ti和Mo)提取了与接触电阻无关的沟道特性。基于这些结果,比较了在源极/漏极重叠区中的器件尺寸和接触结构方面的迁移率特性区域。另外,详细研究了根据源/漏金属电极的接触结构的传输特性,并使用模拟模型进行了复制。

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