首页> 外文期刊>IEEE Transactions on Electron Devices >Equivalent Substrate Model for Lateral Super Junction Device
【24h】

Equivalent Substrate Model for Lateral Super Junction Device

机译:横向超结器件的等效衬底模型

获取原文
获取原文并翻译 | 示例

摘要

The equivalent substrate (ES) model and the accordant optimized structure for the lateral super junction (LSJ) device are proposed in this paper. The ES, defined as the combination of the depleted substrate under the reverse voltage and the charge compensation layer (CCL) in the substrate, is treated as a whole to analyze the modulation impact of the compensation electric field $Delta{E}$ on the total electric field of the LSJ. The analytical formulas for the surface electric field profiles of the LSJ are deduced from the 3-D Poisson equation and the Green function. The ES model reveals the essence and the suppression of the substrate-assisted depletion effect in the LSJ, from which the optimized substrate conditions are achieved. The optimized substrate condition allows the LSJ device featuring a similar breakdown voltage to that of the vertical super junction. Then four typical doping concentrations of the CCLs with four different compensation electric field strengths $Delta{E}_{s}$ are compared. The developed novel device with optimized CCL delivers a breakdown voltage of 301 V, realizing 157% improvement compared with the conventional LSJ with ${L}_{d}=15~mu{rm m}$, which shows a superior performance to the LSJ devices reported. It is noteworthy that the ES model can also be used to analyze other LSJs.
机译:提出了横向超结(LSJ)器件的等效基板(ES)模型和相应的优化结构。 ES被定义为反向电压下耗尽的衬底和衬底中的电荷补偿层(CCL)的组合,整体上分析了补偿电场$ Delta {E} $对其的调制影响。 LSJ的总电场。 LSJ的表面电场轮廓的解析公式由3-D泊松方程和格林函数推导得出。 ES模型揭示了LSJ中底物辅助耗尽效应的实质和抑制作用,从而实现了最佳的底物条件。优化的基板条件使LSJ器件具有与垂直超级结类似的击穿电压。然后,比较具有四个不同补偿电场强度$ Delta {E} _ {s} $的CCL的四个典型掺杂浓度。开发的新型器件具有经过优化的CCL,可提供301 V的击穿电压,与具有$ {L} _ {d} = 15〜mu {rm m} $的常规LSJ相比,实现了157%的改善,这显示出优于LSJ的性能。 LSJ设备已报告。值得注意的是,ES模型也可以用于分析其他LSJ。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号