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Enhanced Near-Infrared Response CMOS Image Sensors Using High-Resistivity Substrate: Photodiodes Design Impact on Performances

机译:使用高电阻率基板的增强型近红外响应CMOS图像传感器:光电二极管设计对性能的影响

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摘要

A three-transistor pixel, front-side-illuminated CMOS image sensor is developed and realized using high-resistivity (HR) silicon ( cm) to enhance its near-infrared response thanks to a large depleted depth. Both TCAD simulations and an analytical model are used to estimate the space-charge region extension of a photodiode. A strong 3-D geometrical variation with pixel design geometry is shown. Punchthrough current measurements in a pixel array are used to demonstrate these variations and their impact. The punchthrough and crosstalk measurements can provide an optimum pixel design on HR silicon. Electrooptical characterization demonstrates excellent quantum efficiency despite slightly degraded crosstalk performances for near-infrared wavelengths.
机译:开发并使用高电阻率(HR)硅(cm)开发并实现了一种三晶体管像素,前照式CMOS图像传感器,以通过大的耗尽深度来增强其近红外响应。 TCAD仿真和分析模型都用于估计光电二极管的空间电荷区域扩展。图中显示了像素设计几何形状存在强烈的3-D几何变化。像素阵列中的穿通电流测量用于证明这些变化及其影响。穿通和串扰测量可以在HR硅片上提供最佳的像素设计。尽管近红外波长的串扰性能略有下降,但电光学表征仍具有出色的量子效率。

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