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Improvement of Subthreshold Characteristic of Gate-Recessed AlGaN/GaN Transistors by Using Dual-Gate Structure

机译:利用双栅结构改善栅极嵌入式AlGaN / GaN晶体管的亚阈值特性

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摘要

The subthreshold characteristic of gate-recessed high-electron-mobility transistors (HEMTs) using dual-gate (DG) architectures is systematically studied. The recessed DG structure can effectively shift the threshold voltage ( ) in the positive direction. Different from the complex function expression between and AlGaN thickness ( ) in the recessed single-gate (SG) device, the variation of with is monotonic in the recessed DG devices. Recessed DG device exhibits a low off-state leakage current of A/mm and gate induced drain leakage is effectively improved. A higher range of recessed DG devices broadens about 2 times and provide a wider range of than that of recessed SG devices. The DG structure has a stronger modulation effect on drain–source resistance ( ) and gate–drain resistance ( ) than the SG devices. A lower subthreshold swing (SS) of ~100 mV/dec is obtained by recessed DG design. Due to the second gate inducing the lateral extension of depletion region between the first gate and drain, the off-state leakage and first gate reverse leakage have been significantly improved. Therefore, the recessed DG architecture design can effectively improve the fluctuation of SS and off-state current versus the different AlGaN barrier thickness.
机译:系统研究了使用双栅(DG)架构的栅凹型高电子迁移率晶体管(HEMT)的亚阈值特性。凹陷的DG结构可以有效地使阈值电压()向正方向移动。与凹入式单栅极(SG)器件中AlGaN厚度()之间的复函数表达式不同,凹入式DG器件中with的变化是单调的。嵌入式DG器件的截止状态漏电流低至A / mm,可有效改善栅极感应的漏极漏电流。嵌入式DG器件的更大范围比嵌入式SG器件扩大了约2倍,并提供了更大的范围。与SG器件相比,DG结构对漏极-源极电阻()和栅极-漏极电阻()的调制作用更强。通过嵌入式DG设计可获得约100 mV / dec的下亚阈值摆幅(SS)。由于第二栅极引起第一栅极和漏极之间的耗尽区的横向延伸,所以截止状态泄漏和第一栅极反向泄漏得到了显着改善。因此,相对于不同的AlGaN势垒厚度,嵌入式DG架构设计可以有效地改善SS和断态电流的波动。

著录项

  • 来源
    《IEEE Transactions on Electron Devices》 |2017年第10期|4057-4064|共8页
  • 作者单位

    State Key Discipline Laboratory of Wide Band-Gap Semiconductor Technology, School of advanced materials and nanotechnology, Xidian University, Xi’an, China;

    State Key Discipline Laboratory of Wide Band-Gap Semiconductor Technology, School of Microelectronics, Xidian University, Xi’an, China;

    State Key Discipline Laboratory of Wide Band-Gap Semiconductor Technology, School of advanced materials and nanotechnology, Xidian University, Xi’an, China;

    State Key Discipline Laboratory of Wide Band-Gap Semiconductor Technology, School of advanced materials and nanotechnology, Xidian University, Xi’an, China;

    State Key Discipline Laboratory of Wide Band-Gap Semiconductor Technology, School of advanced materials and nanotechnology, Xidian University, Xi’an, China;

    State Key Discipline Laboratory of Wide Band-Gap Semiconductor Technology, School of Microelectronics, Xidian University, Xi’an, China;

    State Key Discipline Laboratory of Wide Band-Gap Semiconductor Technology, School of Microelectronics, Xidian University, Xi’an, China;

    State Key Discipline Laboratory of Wide Band-Gap Semiconductor Technology, School of advanced materials and nanotechnology, Xidian University, Xi’an, China;

    State Key Discipline Laboratory of Wide Band-Gap Semiconductor Technology, School of advanced materials and nanotechnology, Xidian University, Xi’an, China;

    State Key Discipline Laboratory of Wide Band-Gap Semiconductor Technology, School of advanced materials and nanotechnology, Xidian University, Xi’an, China;

    School of Mechano-Electronic Engineering, Xidian University, Xi’an, China;

    State Key Discipline Laboratory of Wide Band-Gap Semiconductor Technology, School of advanced materials and nanotechnology, Xidian University, Xi’an, China;

    State Key Discipline Laboratory of Wide Band-Gap Semiconductor Technology, School of Microelectronics, Xidian University, Xi’an, China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Aluminum gallium nitride; Wide band gap semiconductors; Logic gates; HEMTs; MODFETs; Threshold voltage; Current measurement;

    机译:氮化铝镓;宽带隙半导体;逻辑门;HEMT;MODFET;阈值电压;电流测量;

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