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Gate Leakage Mechanisms in AlInN/GaN and AlGaN/GaN MIS-HEMTs and Its Modeling

机译:AlInN / GaN和AlGaN / GaN MIS-HEMT中的栅极泄漏机理及其建模

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Gate leakage mechanisms in AlInN/GaN and AlGaN/GaN metal insulator semiconductor high-electron-mobility transistors (MIS-HEMTs) with SiN as gate dielectric have been investigated. It is found that the conduction in the reverse gate bias is due to Poole-Frenkel emission for both MIS-HEMTs. The dominant conduction mechanism in low to medium forward bias is trap-assisted tunneling while it is Fowler–Nordheim tunneling at high forward bias. However, conduction near zero gate bias is dominated by defect-assisted tunneling for both sets of MIS-HEMTs. The gate leakage current is primarily dependent on the properties of the gate dielectric material and dielectric/ semiconductor interface rather than the barrier layer. A model is proposed for the gate leakage current in GaN-based MIS-HEMTs, and the method to extract the related model parameters is also presented in this paper. The proposed gate current model matches well with the experimental results for both AlInN/GaN and AlGaN/GaN MIS-HEMTs over a wide range of gate bias and measurement temperature.
机译:研究了以SiN为栅极电介质的AlInN / GaN和AlGaN / GaN金属绝缘体半导体高电子迁移率晶体管(MIS-HEMT)中的栅极泄漏机理。发现在反向栅极偏置中的传导是由于两个MIS-HEMT的普尔-弗伦克发射引起的。低至中向正向偏压的主要传导机制是陷阱辅助隧穿,而高正向偏压则为Fowler-Nordheim隧穿。但是,对于两组MIS-HEMT,缺陷栅极隧穿控制着零栅极偏置附近的导电。栅极泄漏电流主要取决于栅极电介质材料和电介质/半导体界面的特性,而不是阻挡层的特性。提出了基于GaN的MIS-HEMT中栅极漏电流的模型,并提出了提取相关模型参数的方法。所提出的栅极电流模型与AlInN / GaN和AlGaN / GaN MIS-HEMT的实验结果在很大的栅极偏置和测量温度范围内都非常吻合。

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