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p-Channel TFET Operation of Bilayer Structures With Type-II Heterotunneling Junction of Oxide- and Group-IV Semiconductors

机译:双层结构的P沟道TFET与氧化物和IV型半导体的II型异陶孔结合

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We propose a p-channel bilayer TFET composed of an n-type oxide semiconductor (n-OS)/p-type group-IV semiconductor (p-IV) heterostructure, allowing us to realize both n- and p-channel TFET operations under the same device structure. Here, the p-IV side in the heterostructure has a metal-oxide-semiconductor (MOS) gate-stack that modulates the surface potential of the p-IV MOS interface and controls the band-to-band tunneling (BTBT) current under the p-TFET operation. Technology computer-aided design (TCAD) simulation predicts the p-TFET operation with symmetric electrical characteristics to the n-TFET operation. Moreover, we experimentally demonstrate the p-TFET operation of the n-ZnSnO/p-SiGe bilayer device, fabricated on a SiGe-on-insulator substrate, under Si back-gate operation. In addition, both n- and p-TFET operations are observed in an identical device by using the top- and back-gate electrodes.
机译:我们提出由N型氧化物半导体(N-OS)/ p型基团-4-IV半导体(P-IV)异质结构组成的P沟道双层TFET,允许我们实现N-和P沟道TFET操作相同的设备结构。这里,异质结构中的P-IV侧具有金属氧化物 - 半导体(MOS)栅极堆叠,其调制P-IV MOS接口的表面电位,并控制下方的带对带隧道(BTBT)电流P-TFET操作。技术计算机辅助设计(TCAD)仿真预测对称电气特性的P-TFET操作到N-TFET操作。此外,我们通过实验证明了在SiGe-on-Insulator衬底上制造的N-ZnSNO / P-SiGe双层装置的P-TFET操作,如Sie-On-Insulator基板在Si后栅操作下。另外,通过使用顶部和后栅电极在相同的装置中观察到N-和P-TFET操作。

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