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Impact of Mixed Negative Bias Temperature Instability and Hot Carrier Stress on MOSFET Characteristics—Part II: Theory

机译:混合负偏置温度不稳定性和热载流子应力对MOSFET特性的影响-第二部分:理论

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In this paper, we examine the interplay of two serious reliability issues in MOSFET devices, namely, bias temperature instability (BTI) and hot-carrier degradation (HCD). Most publications are devoted to the characterization of either BTI or HCD, and complex models have been developed to independently describe each degradation mode. However, very limited data are available on the interplay of both degradation regimes, particularly the effect of a drain bias onto the charging and discharging dynamics of oxide traps. Part I of this paper provides an extensive experimental study toward the impact of mixed-mode stress conditions on the dynamics of oxide defects. Here, we present the first microscopic modeling approach beyond a simple electrostatic approximation. We extend the existing nonradiative multiphonon theory by taking nonequilibrium processes such as full carrier distribution functions which include the effect impact ionization along the channel into account. To ultimately validate our framework, we compare simulation results and experimental data for a single-oxide defect as well as a large ensemble of traps in a MOSFET device. We show that our modeling approach accurately captures the rather puzzling measurement trends for a broad stress regime and allows developing the knowledge on how oxide defects can be affected by an increased drain stress.
机译:在本文中,我们研究了MOSFET器件中两个严重的可靠性问题之间的相互作用,即偏置温度不稳定性(BTI)和热载流子劣化(HCD)。大多数出版物致力于BTI或HCD的表征,并且已经开发出复杂的模型来独立描述每种降解模式。但是,关于两种降解机制之间相互作用的数据非常有限,特别是漏极偏压对氧化物陷阱的充电和放电动力学的影响。本文的第一部分对混合模式应力条件对氧化物缺陷动力学的影响进行了广泛的实验研究。在这里,我们提出了除简单的静电近似之外的第一种微观建模方法。我们通过考虑非平衡过程(例如完整的载流子分布函数)来扩展现有的非辐射多声子理论,其中包括影响沿通道电离的影响。为了最终验证我们的框架,我们比较了MOSFET器件中单氧化物缺陷以及大量陷阱的仿真结果和实验数据。我们表明,我们的建模方法可以准确地捕获在宽应力范围内相当令人费解的测量趋势,并可以开发有关氧化物缺陷如何受增大的漏极应力影响的知识。

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