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Enhanced high-frequency performance in a GaAs, self-aligned, n-JFET using a carbon buried p-implant

机译:使用碳埋入p注入的GaAs自对准n-JFET中增强的高频性能

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C ion implantation has been employed, for the first time, to form the buried p-layer in GaAs, self-aligned, ion implanted JFETs. Comparable DC performance was seen for JFETs with C or Mg implants; however, C-backside JFETs showed superior high-frequency performance. High dose C-backside devices had a f/sub t/ of 28.3 GHz and a f/sub max/ of 43.2 GHz for a 0.5 /spl mu/m gate length that were 28% and 46% higher, respectively, than comparable Mg-implanted JFETs. This enhancement is a result of the lower C/sub gs/ in the C-backside device resulting from he inherently low activation of the implanted C below the channel while the C still effectively compensated the tail of the Si-channel implant. This approach relaxes the trade-off between optimizing the DC and the AC performance for the buried p-implant in GaAs JFETs and MESFET's.
机译:首次采用C离子注入在GaAs自对准离子注入JFET中形成掩埋p层。对于具有C或Mg注入的JFET,可以看到可比的DC性能。但是,C背JFET具有出色的高频性能。高剂量C背面器件的栅极长度为0.5 / spl mu / m时,af / sub t /为28.3 GHz,af / sub max /为43.2 GHz,分别比同等注入的Mg高28%和46%。 JFET。这种增强是由于C型背面器件中C / sub gs /较低的结果,这是由于其在沟道下方的注入C的固有低激活性,而C仍然有效地补偿了Si沟道注入的尾部。这种方法放宽了在GaAs JFET和MESFET的埋入p型注入的优化DC和AC性能之间的权衡。

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