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Mobility improvement of n-MOSFET's with nitrided gate oxide by backsurface Ar/sup +/ bombardment

机译:通过背面Ar / sup + /轰击提高具有氮化栅氧化物的n-MOSFET的迁移率

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Low-energy (550 eV) argon-ion beam was used to bombard directly, the backsurface of nitrided n-MOSFET's after the completion of all conventional nMOS processing steps. The interface characteristics and inversion layer mobility of the MOS devices were investigated. The results show that, as bombardment time increases, interface state density and fixed charge density decrease first, and then the change slows down or even turns around. Correspondingly, the carrier mobility and drain conductance of the MOS devices are found to enhance first, and then saturate or turn around. Therefore, this simple technique, which is readily compatible with existing IC processing, is effective for restoring some of the lost device performance associated with gate-oxide nitridation.
机译:在完成所有常规nMOS处理步骤后,使用低能(550 eV)氩离子束直接轰击氮化的n-MOSFET的背面。研究了MOS器件的界面特性和反型迁移率。结果表明,随着轰击时间的增加,界面态密度和固定电荷密度先降低,然后变化减慢甚至转回。相应地,发现MOS器件的载流子迁移率和漏极电导率先增强,然后饱和或转弯。因此,这种简单的技术很容易与现有的IC处理兼容,可有效地恢复与栅极氧化氮化有关的器件性能损失。

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