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Characterization of effective mobility by split C(V) technique in N-MOSFETs with ultra-thin gate oxides

机译:通过分裂C(V)技术在具有超薄栅极氧化物的N-MOSFET中表征有效迁移率

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摘要

Reliable split C(V) measurements are shown to be feasible on ultra-thin oxides (down to 1.2 nm) by using relatively small area MOSFETs (typically 100 μm~2). To this end, specific correction procedures for parasitic parallel capacitances and gate leakage impact on source-drain current characteristics are proposed. The amplitude of the effective mobility is found to be degraded significantly with oxide scaling. Moreover, the mobility attenuation at high field associated to the surface roughness remains unchanged with oxide thickness reduction. This mobility degradation could find its origin in enhanced remote coulomb or interface plasmon-phonon scattering processes, which are reinforced by Oxide thinning.
机译:通过使用相对较小面积的MOSFET(通常为100μm〜2),对超薄氧化物(低至1.2 nm)进行可靠的C(V)分离测量是可行的。为此,提出了针对寄生并联电容和栅极泄漏对源极-漏极电流特性的影响的特定校正程序。发现有效迁移率的幅度随着氧化物结垢而显着降低。而且,随着氧化物厚度的减小,与表面粗糙度相关的高电场下的迁移率衰减保持不变。这种迁移率下降可能是由于增强的远程库仑或界面等离振子-声子散射过程引起的,而这种过程通过氧化物稀化得到加强。

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