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High-temperature performance of GaAs-based HFET structure containing LT-AlGaAs and LT-GaAs

机译:包含LT-AlGaAs和LT-GaAs的GaAs基HFET结构的高温性能

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Using low-temperature grown layers a GaAs-based HFET structure was developed, which demonstrates for the first time high performance at high temperatures up to 540/spl deg/C, where the gate diode shunts through. The device was designed for operation in the hot electron regime using an LT-AlGaAs passivation layer. Thus, the open channel current density and gain bandwidth product are exceptionally stable (I/sub D500/spl deg/C//I/sub DR.T./=0.9; f/sup T200/spl deg/C/f/sub TR.T./=0.9). The f/sub max/ cutoff frequency is the most temperature sensitive parameter {(f/sub max//f/sub T/)/sub R.T./=3.9 and (f/sub max//f/sub T/)/sub 200/spl deg/C/=2.8} due to the thermal activation of the buffer layer leakage, which is kept extremely small using LT-GaAs.
机译:使用低温生长层,开发了基于GaAs的HFET结构,该结构首次证明了在高达540 / spl deg / C的高温下高性能,其中栅极二极管分流通过。该器件设计为使用LT-AlGaAs钝化层在热电子状态下运行。因此,开路电流密度和增益带宽乘积异常稳定(I / sub D500 / spl deg / C // I / sub DR.T./=0.9;f/sup T200 / spl deg / C / f / sub TR.T./=0.9)。 f / sub max /截止频率是对温度最敏感的参数{(f / sub max // f / sub T /)/ sub RT / = 3.9和(f / sub max // f / sub T /)/ sub 200 / spl deg / C / = 2.8}是由于缓冲层泄漏的热激活引起的,使用LT-GaAs可以将其保持在极小的水平。

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