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Si/SiGe n-MODFETs on thin SiGe virtual substrates prepared by means of He implantation

机译:通过He注入制备的薄SiGe虚拟衬底上的Si / SiGe n-MODFET

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Si/SiGe n-type modulation-doped field-effect transistors grown on a very thin strain-relieved Si/sub 0.69/Ge/sub 0.31/ buffer on top of a Si(100) substrate were fabricated and characterized. This novel type of virtual substrate has been created by means of a high dose He ion implantation localized beneath a 95-nm-thick pseudomorphic SiGe layer on Si followed by a strain relaxing annealing step at 850/spl deg/C. The layers were grown by molecular beam epitaxy. Electron mobilities of 1415 cm/sup 2//Vs and 5270 cm/sup 2//Vs were measured at room temperature and 77 K, respectively, at a sheet carrier density of about 3/spl times/10/sup 12//cm/sup 2/. The fabricated transistors with Pt-Schottky gates showed good dc characteristics with a drain current of 330 mA/mm and a transconductance of 200 mS/mm. Cutoff frequencies of f/sub t/=49 GHz and f/sub max/=95 GHz at 100 nm gate length were obtained which are quite close to the figures of merit of a control sample grown on a conventional, thick Si/sub 0.7/Ge/sub 0.3/ buffer.
机译:制作并表征了生长在Si(100)衬底顶部非常薄的应力消除Si / sub 0.69 / Ge / sub 0.31 /缓冲器上的Si / SiGe n型调制掺杂的场效应晶体管。通过在Si上95 nm厚的伪晶SiGe层下方进行大剂量He离子注入,然后以850 / spl deg / C的应变松弛退火步骤,创建了这种新型的虚拟衬底。通过分子束外延生长这些层。在室温和77 K下分别以约3 / spl次/ 10sup 12 // cm的薄片载体密度测量了1415 cm / sup 2 // Vs和5270 cm / sup 2 // Vs的电子迁移率/ sup 2 /。具有Pt-肖特基栅极的已制造晶体管具有良好的直流特性,其漏极电流为330 mA / mm,跨导为200 mS / mm。在100 nm的栅长处获得f / sub t / = 49 GHz和f / sub max / = 95 GHz的截止频率,该截止频率非常接近在常规的厚Si / sub 0.7上生长的对照样品的品质因数。 / Ge / sub 0.3 /缓冲区。

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