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High-performance p-channel Schottky-barrier SOI FinFET featuring self-aligned PtSi source/drain and electrical junctions

机译:具有自对准PtSi源/漏和电结的高性能p沟道肖特基势垒SOI FinFET

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摘要

A simplified and improved Schottky-barrier metal-oxide-semiconductor device featuring a self-aligned offset channel length, PtSi Schottky junction, and reduced oxide thickness underneath the sub-gate was proposed and demonstrated. To alleviate the drawbacks related to the nonself-aligned offset channel length in the original version, a self-aligned offset channel length is achieved in the new device by forming the silicide source/drain junction self-aligning to the sidewall spacers abutting the gate. This results in not only one mask count saving but also better device performance, as facilitated by the reduced offset channel length of the self-aligned sidewall spacers. Moreover, the adoption of PtSi for the Schottky junction further improves the on-state current of p-channel operation, while a thinner oxide employed underneath the sub-gate effectively reduces the sub-gate bias needed to form the electrical junction to below 5 V. Significant improvement in on-current as well as leakage current reduction is achieved in the new improved device.
机译:提出并演示了一种简化和改进的肖特基势垒金属氧化物半导体器件,该器件具有自对准的偏置沟道长度,PtSi肖特基结,并且子栅下方的氧化物厚度减小。为了减轻与原始版本中的非自对准偏置沟道长度有关的缺陷,在新器件中通过形成与对准栅极的侧壁间隔物自对准的硅化物源极/漏极结来实现自对准偏置沟道长度。由于减少了自对准侧壁间隔件的偏移沟道长度,这不仅节省了一个掩模数量,而且还带来了更好的器件性能。此外,肖特基结采用PtSi可以进一步改善p沟道操作的导通电流,而在子栅下方采用更薄的氧化物可有效地降低形成电结所需的子栅偏置至5 V以下新改进的器件实现了导通电流的显着改善以及漏电流的减少。

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