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Electron Transport in Strained-Silicon Directly on Insulator Ultrathin-Body n-MOSFETs With Body Thickness Ranging From 2 to 25 nm

机译:直接在绝缘体超薄体n-MOSFET上的应变硅中电子传输,体厚度范围为2至25 nm

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The electron effective mobility in ultrathin-body n-channel metal-oxide-semiconductor field-effect transistors fabricated on Ge-free 30% strained-Si directly on insulator (SSDOI) is mapped as the body thickness is scaled. Effective mobility and device body thickness were extracted using current-voltage and gate-to-channel capacitance-voltage measurements as well as cross-sectional transmission electron microscopy. Devices with body thicknesses ranging from 2 to 25 nm are studied. Significant mobility enhancements ( ~1.8x) compared to unstrained SOI are observed for 30% SSDOI with body thicknesses of above 3.5 nm. The mobility exhibits a sharp drop as the body thickness is scaled below 3.5 nm
机译:随着体厚度的缩放,绘制了在绝缘体上无锗的30%应变硅上直接制造的超薄体n沟道金属氧化物半导体场效应晶体管中的电子有效迁移率(SSDOI)。使用电流-电压和栅-通道电容-电压测量以及横截面透射电子显微镜来提取有效迁移率和器件主体厚度。研究了厚度在2至25 nm之间的器件。对于30%的SSDOI,体厚超过3.5 nm,观察到与未应变的SOI相比,迁移率显着提高(〜1.8倍)。当主体厚度缩小到3.5 nm以下时,迁移率会急剧下降

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