首页> 外文期刊>IEEE Electron Device Letters >Fabrication and Performance of 0.25-$mu$m Gate Length Depletion-Mode GaAs-Channel MOSFETs With Self-Aligned InAlP Native Oxide Gate Dielectric
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Fabrication and Performance of 0.25-$mu$m Gate Length Depletion-Mode GaAs-Channel MOSFETs With Self-Aligned InAlP Native Oxide Gate Dielectric

机译:具有自对准InAlP原生氧化物栅极电介质的0.25-μm栅极长度耗尽型GaAs沟道MOSFET的制备和性能

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The fabrication and performance of 0.25-$mu$m gate length GaAs-channel MOSFETs using the wet thermal native oxide of InAlP as the gate dielectric are reported. A fabrication process that self-aligns the gate oxidation to the gate recess and metallization to reduce the source access resistance is demonstrated for the first time. The fabricated devices exhibit a peak extrinsic transconductance of 144 mS/mm, an on-resistance of 3.46 $Omega$-mm, and a threshold voltage of $-1.8$ V for typical 0.25- $mu$m gate devices. A record cutoff frequency $f_t$ of 31 GHz for a GaAs-channel MOSFET and a maximum frequency of oscillation $f_{{bf max}}$ of 47 GHz have also been measured.
机译:报道了使用InAlP的湿热自然氧化物作为栅极电介质的0.25-μm栅长GaAs沟道MOSFET的制造和性能。首次展示了将栅极氧化层自动对准栅极凹槽并进行金属化以降低源极访问电阻的制造工艺。对于典型的0.25-μm栅极器件,所制造的器件表现出峰值非本征跨导为144mS / mm,导通电阻为3.46Ω-mm,阈值电压为-1.8V。 GaAs沟道MOSFET的记录截止频率$ f_t $为31 GHz,最大振荡频率$ f _ {{bf max}} $为47 GHz。

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