首页> 外文期刊>Electron Device Letters, IEEE >Voltage Ramp Stress for Bias Temperature Instability Testing of Metal-Gate/High- $k$ Stacks
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Voltage Ramp Stress for Bias Temperature Instability Testing of Metal-Gate/High- $k$ Stacks

机译:用于金属门/高$ k $堆栈的偏置温度不稳定性测试的电压斜坡应力

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摘要

A novel voltage-ramp-stress (VRS) methodology is introduced for bias temperature instability testing of metal-gate/high-$k$ (MG/HK) CMOS devices. Results from VRS are compared with the constant-voltage-stress procedure. It is demonstrated that the voltage and time dependence measured with both methods agree well with each other. These findings make the VRS test the preferred procedure for screening and process monitoring of MG/HK CMOS technologies because the test always yields measurable shifts and little knowledge about gate-stack details is required.
机译:引入了一种新颖的电压-斜坡-应力(VRS)方法,用于金属栅/高$ k $(MG / HK)CMOS器件的偏置温度不稳定性测试。将VRS的结果与恒定电压应力程序进行比较。结果表明,两种方法测得的电压和时间相关性相互吻合。这些发现使VRS测试成为MG / HK CMOS技术的筛选和过程监控的首选程序,因为该测试总是产生可测量的偏移,并且几乎不需要栅极堆叠细节。

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