机译:使用$ hbox {Sm} _ {2} hbox {O} _ {3} / hbox {SiO} _ {2} $介电堆栈有效地调制MIM电容器中电容的二次电压系数
Dept. Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore;
MIM devices; analogue circuits; capacitors; dielectric devices; samarium compounds; silicon compounds; MIM capacitors; Sm2O3-SiO2; analog circuit applications; canceling effect; capacitance density; dielectric stack; leakage current density; metal-insulator-metal; positive quadratic voltage coefficient of capacitance; $hbox{SiO}_{2}$; $hbox{Sm}_{2}hbox{O}_{3}$; capacitor; metal–insulator–metal (MIM); quadratic voltage coefficient of capacitance (VCC);
机译:$ hbox {ZrLaO} _ {x} hbox {/ ZrTiO} _ {x} $层压板作为MIM电容器的绝缘体,具有抵消电容,具有高电容密度和低二次方电压系数
机译:具有$ hbox {Sm} _ {2} hbox {O} _ {3} $和$ hbox {Sm} _ {2} hbox {O} _ {{3} / hbox)的金属-绝缘子-金属电容器的物理和电气特性用于模拟电路应用的{SiO} _ {2} $叠层电介质
机译:$ hbox {Al} _ {2} hbox {O} _ {3} $掺杂的$ hbox {ZrO} _ {2} $高介电常数介电体的导电机理及击穿特性–金属电容器
机译:具有Al / sub 2 / O / sub 3 /堆叠MIM电容器的高度可制造的110 nm EDRAM工艺,可实现经济高效的高密度,高速,低压ASIC存储器应用
机译:高K栅极电介质堆叠的电压和温度相关的栅极电容和电流模型
机译:在$$ hbox {bi} _ {1.65} hbox {pb} _ {0.35} hbox {sr} _2 hbox {ca} _ {2.5}} _ {2.5} hbox {x } _ {3.5} hbox {o} _y $$ Bi 1.65 PB 0.35 SR 2 CA 2.5 CU 3.5 O Y陶瓷