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首页> 外文期刊>Electron Devices, IEEE Transactions on >Physical and Electrical Characterization of Metal–Insulator–Metal Capacitors With $hbox{Sm}_{2}hbox{O}_{3}$ and $hbox{Sm}_{2}hbox{O}_{3}/hbox{SiO}_{2}$ Laminated Dielectrics for Analog Circuit Applications
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Physical and Electrical Characterization of Metal–Insulator–Metal Capacitors With $hbox{Sm}_{2}hbox{O}_{3}$ and $hbox{Sm}_{2}hbox{O}_{3}/hbox{SiO}_{2}$ Laminated Dielectrics for Analog Circuit Applications

机译:具有$ hbox {Sm} _ {2} hbox {O} _ {3} $和$ hbox {Sm} _ {2} hbox {O} _ {{3} / hbox)的金属-绝缘子-金属电容器的物理和电气特性用于模拟电路应用的{SiO} _ {2} $叠层电介质

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We report the first demonstration of metal–insulator–metal (MIM) capacitors with $hbox{Sm}_{2}hbox{O}_{3}/hbox{SiO}_{2}$ laminated dielectrics featuring low quadratic voltage coefficient of capacitance (VCC) and high capacitance density for precision analog circuit applications. In comparison with a $hbox{HfO}_{2}$ MIM dielectric, the $hbox{Sm}_{2}hbox{O}_{3}$ MIM dielectric is found to show a smaller quadratic VCC and a similar dielectric constant. We also investigated the cancellation of the positive quadratic VCC of $hbox{Sm}_{2}hbox{O}_{3}$ through its combination with a $hbox{SiO}_{2}$ layer having a negative quadratic VCC. Thus, MIM capacitors with a $hbox{Sm}_{2}hbox{O}_{3}/ hbox{SiO}_{2}$ laminated dielectric were fabricated with various $hbox{Sm}_{2}hbox{O}_{3}$ and $hbox{SiO}_{2}$ thickness combinations. Capacitors with the $hbox{Sm}_{2}hbox{O}_{3}/ hbox{SiO}_{2}$ laminated dielectric exhibit tunable quadratic VCC and high capacitance density. Very low quadratic VCC at various capacitance densities were achieved. The leakage current mechanism is related to Poole–Frenkel emission at a high positive bias. A smaller quadratic VCC is obtained at higher frequencies. We also conducted an extensive physical characterization of $hbox{Sm}_{2} hbox{O}_{3}$ using trans-nmission electron microscopy, X-ray diffraction, and X-ray photoelectron spectroscopy.
机译:我们报道了具有$ hbox {Sm} _ {2} hbox {O} _ {3} / hbox {SiO} _ {2} $层压电介质的二次绝缘系数低的金属-绝缘体-金属(MIM)电容器的首次演示电容(VCC)和高电容密度的组合,适用于精密模拟电路应用。与$ hbox {HfO} _ {2} $ MIM电介质相比,$ hbox {Sm} _ {2} hbox {O} _ {3} $ MIM电介质显示出较小的二次VCC和类似的电介质不变。我们还研究了$ hbox {Sm} _ {2} hbox {O} _ {3} $与具有负二次VCC的$ hbox {SiO} _ {2} $层的组合对正二次VCC的抵消。因此,制造了具有$ hbox {Sm} _ {2} hbox {O} _ {3} / hbox {SiO} _ {2} $层压电介质的MIM电容器,并使用了各种$ hbox {Sm} _ {2} hbox { O} _ {3} $和$ hbox {SiO} _ {2} $厚度组合。具有$ hbox {Sm} _ {2} hbox {O} _ {3} / hbox {SiO} _ {2} $叠层电介质的电容器表现出可调谐的二次VCC和高电容密度。在各种电容密度下,实现了非常低的二次VCC。漏电流机制与高正偏压下的Poole-Frenkel发射有关。在较高的频率下可获得较小的二次VCC。我们还使用透射电子显微镜,X射线衍射和X射线光电子能谱对$ hbox {Sm} _ {2} hbox {O} _ {3} $进行了广泛的物理表征。

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