首页> 外文期刊>IEEE Electron Device Letters >Local Electro-Thermal Annealing for Repair of Total Ionizing Dose-Induced Damage in Gate-All-Around MOSFETs
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Local Electro-Thermal Annealing for Repair of Total Ionizing Dose-Induced Damage in Gate-All-Around MOSFETs

机译:局部电热退火修复全能栅极MOSFET中总电离剂量引起的损坏

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A shift in threshold voltage caused by total ionizing dose (TID) is problematic in the MOSFET, especially in aerospace applications. Unlike traditional methods to minimize damage from TID, in this letter, a novel electro-thermal annealing method to cure the TID-induced damage is demonstrated for the first time. In this concept, the conventional hardening or shielding techniques are not used. In a gate-all-around MOSFET structure, dual gate electrodes were employed as an embedded nanowire heater to generate localized Joule heat, which can anneal insulating layers, including gate oxide and spacer. With the Joule heat, trapped positive charges produced by the TID were neutralized within 200 ms. A damaged device with a radiation-induced threshold voltage shift was repaired to the level of a fresh pristine device.
机译:由总电离剂量(TID)引起的阈值电压偏移在MOSFET中是有问题的,尤其是在航空航天应用中。与传统的将TID造成的损害降至最低的方法不同,在本文中,首次展示了一种新型的电热退火方法来治愈TID引起的损害。在此概念中,不使用常规的硬化或屏蔽技术。在环绕栅MOSFET结构中,双栅电极被用作嵌入式纳米线加热器以产生局部焦耳热,该焦耳热可以使包括栅氧化物和隔离层在内的绝缘层退火。利用焦耳热,TID产生的捕获的正电荷在200毫秒内被中和。带有辐射引起的阈值电压偏移的损坏设备被修复到新的原始设备的水平。

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