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Abnormal High Resistive State Current Mechanism Transformation in Ti/HfO2/TiN Resistive Random Access Memory

机译:Ti / HFO2 / TIN电阻随机存取存储器中异常高电阻状态电流机构变换

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In this letter, the electrical characteristics of Ti/HfO2/TiN resistive random access memory (RRAM) were thoroughly investigated. An abnormal current degradation was seen in the DC sweeping cycle. Both the on-state and off-state current clearly exhibited degradation with time. Next, current fitting analysis was used to investigate the carrier transport mechanisms. The results indicate that the on-state carrier transport mechanism changed from space-charge-limited current into hopping conduction after cycle sweeping. However, the off-state current changes from Schottky thermal emission to hopping conduction. Based on comparisons of different Schottky distances and Schottky barriers, physical models were proposed to explain the abnormal current degradation behavior. Finally, COMSOL electric field simulations were used to show the electric field distribution around the conducting filament (CF), and the conducting model was subsequently verified.
机译:在这封信中,彻底研究了Ti / HFO2 / TIN电阻随机存取存储器(RRAM)的电气特性。在DC扫描循环中看到异常的电流降解。在状态和断线电流都明确表现出与时间的降级。接下来,使用电流拟合分析来研究载体传输机制。结果表明,在循环扫描之后,导通状态载波运输机构从空穴电荷限制变为跳跃传导。然而,脱态电流从肖特基热排放到跳跃传导。基于不同肖特基距离和肖特基障碍的比较,提出了物理模型来解释异常的电流降解行为。最后,使用COMSOL电场模拟来显示导电丝(CF)周围的电场分布,随后验证了导电模型。

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