首页> 外文期刊>Applied Surface Science >Characterization and optimization of MIS-HEMTs device of high~k dielectric material on quaternary barrier of Alo.42lno.o3Gao.55N/UID-AIN/GaN/GaN heterostructure for high power switching application
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Characterization and optimization of MIS-HEMTs device of high~k dielectric material on quaternary barrier of Alo.42lno.o3Gao.55N/UID-AIN/GaN/GaN heterostructure for high power switching application

机译:高〜k介电材料MIS-HEMTS装置的特征与优化ALO.42LNO.O3GaO.55N / UID-AIN / GAN / GAN异质结构进行高功率开关应用

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In this study, the structure of efficient recessed gate Metal Insulator Semiconductor High Electron Mobility Transistor with Quaternary Barrier materials of Al(0.42)in(0.03)Ga(0.55)N was simulated and presented. The device with heterostructure of Al(0.42)in(0.03)Ga(0.55)N/UID-AIN/GaN/GaN and thickness of 5 nm/10 nm/40 nm/10 mu m on SiC substrate shows normally-OFF characteristics. The effect of high similar to k dielectrics of HfAlxOx and the quaternary barrier on the electrical performance of the device was analyzed and compared with the conventional AlGaN/GaN heterostructure. We found that the charge optimization concept of the polarization induced charges of the device 2DEG in the channel was due to the combination of the Quaternary Barrier of Al(0.42)in(0.03)Ga(0.55)N and the high similar to k dielectrics of HfAlxOx. Furthermore, the two field plates used which are having a length of plate at the drain (LGFP) of 1.8 mu m and field plate at the source (L-GPS) 0.5 mu m effectively spread the electric field lines with the drain and showed a significant improvement in the electrical properties of the device and achieved a maximum drain current of 710 mA/mmV, low transconductance (g(m)) of 0.158 Smm(-1) and high breakdown voltage of 570 V. In comparison to the conventional AlGaN/GaN MIS-HEMTs of similar design, the result of this Quaternary Barrier Metal Insulator Semiconductor High Electron Mobility Transistor (QB-MIS-HEMTs) exhibited a better interface property, remarkable suppression of leakage current, and excellent breakdown voltage which are important for power switching applications.
机译:在该研究中,模拟并呈现了具有Al(0.03)Ga(0.03)Na(0.03)Ga(0.55)N的季屏障材料的高效凹陷栅极金属绝缘体半导体高电子迁移率晶体管的结构。具有(0.03)Ga(0.55)N / UID-AIN / GaN / GaN的异质结构的装置(0.03)(0.55)N / UID-AIN / GaN和SiC衬底上的5nm / 10nm / 40nm /10μm的厚度显示常截止特性。分析了HFALXOX的高相似与k电介质的影响和对装置的电气性能的季级屏障进行了分析,与常规的AlGaN / GaN异质结构进行了比较。我们发现,沟道中的装置2deg的极化诱导电荷的电荷优化概念是由于(0.03)Ga(0.55)n(0.55)n(0.55)n的季栅(0.42)的季栅和高相似的电介质的组合Hfalxox。此外,使用的两个磁场板在源极(LGFP)的漏极(LGFP)处具有1.8μm和源极(L-GPS)0.5μm的场板的板材有效地扩展了电场线与漏极展开并显示了一个在装置的电气性能下显着改善,并实现了710mA / mmV的最大漏极电流,低跨导(G(m))为0.158 smm(-1)和570V的高击穿电压。与传统的AlGaN相比/ GaN MIS-HEMTS类似设计,这种四元屏障金属绝缘体半导体高电子迁移率晶体管(QB-MIS-HEMTS)的结果表现出更好的界面性质,显着抑制漏电流,并且优异的击穿电压对于功率很重要切换应用程序。

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