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首页> 外文期刊>Applied Surface Science >Characterization and optimization of MIS-HEMTs device of high~k dielectric material on quaternary barrier of Alo.42lno.o3Gao.55N/UID-AIN/GaN/GaN heterostructure for high power switching application
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Characterization and optimization of MIS-HEMTs device of high~k dielectric material on quaternary barrier of Alo.42lno.o3Gao.55N/UID-AIN/GaN/GaN heterostructure for high power switching application

机译:大功率开关应用Alo.42lno.o3Gao.55N / UID-AIN / GaN / GaN异质结构四级势垒上高k介电材料MIS-HEMTs器件的表征和优化

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In this study, the structure of efficient recessed gate Metal Insulator Semiconductor High Electron Mobility Transistor with Quaternary Barrier materials of Al(0.42)in(0.03)Ga(0.55)N was simulated and presented. The device with heterostructure of Al(0.42)in(0.03)Ga(0.55)N/UID-AIN/GaN/GaN and thickness of 5 nm/10 nm/40 nm/10 mu m on SiC substrate shows normally-OFF characteristics. The effect of high similar to k dielectrics of HfAlxOx and the quaternary barrier on the electrical performance of the device was analyzed and compared with the conventional AlGaN/GaN heterostructure. We found that the charge optimization concept of the polarization induced charges of the device 2DEG in the channel was due to the combination of the Quaternary Barrier of Al(0.42)in(0.03)Ga(0.55)N and the high similar to k dielectrics of HfAlxOx. Furthermore, the two field plates used which are having a length of plate at the drain (LGFP) of 1.8 mu m and field plate at the source (L-GPS) 0.5 mu m effectively spread the electric field lines with the drain and showed a significant improvement in the electrical properties of the device and achieved a maximum drain current of 710 mA/mmV, low transconductance (g(m)) of 0.158 Smm(-1) and high breakdown voltage of 570 V. In comparison to the conventional AlGaN/GaN MIS-HEMTs of similar design, the result of this Quaternary Barrier Metal Insulator Semiconductor High Electron Mobility Transistor (QB-MIS-HEMTs) exhibited a better interface property, remarkable suppression of leakage current, and excellent breakdown voltage which are important for power switching applications.
机译:在本研究中,模拟并提出了一种有效的具有第四势垒材料为Al(0.42)in(0.03)Ga(0.55)N的嵌入式金属栅绝缘体半导体高电子迁移率晶体管的结构。在SiC衬底上具有Al(0.42)in(0.03)Ga(0.55)N / UID-AIN / GaN / GaN异质结构且厚度为5nm / 10nm / 40nm /10μm的器件显示出常关特性。分析了HfAlxOx的k介电常数和四级势垒的高相似性对器件电性能的影响,并将其与常规AlGaN / GaN异质结构进行了比较。我们发现,通道中器件2DEG的极化感应电荷的电荷优化概念是由于Al(0.42)in(0.03)Ga(0.55)N的第四级势垒和与之相似的k介电常数高而形成的。 HfAlxOx。此外,所使用的两个场板在漏极(LGFP)处的板长为1.8μm,在源极(L-GPS)处的板长为0.5μm,有效地将电场线与漏极分开,并显示出显着改善了器件的电性能,并实现了710 mA / mmV的最大漏极电流,0.158 Smm(-1)的低跨导(g(m))和570 V的高击穿电压。与常规AlGaN相比/ GaN MIS-HEMTs的相似设计,此四级势垒金属绝缘体半导体高电子迁移率晶体管(QB-MIS-HEMTs)的结果显示出更好的界面性能,显着的漏电流抑制和出色的击穿电压,这对于功率至关重要切换应用程序。

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