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Preparation of tantalum oxide thin films by photo-assisted atomic layer deposition

机译:光辅助原子层沉积制备氧化钽薄膜

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Tantalum oxide thin films were prepared by photo-assisted atomic layer deposition (Photo-ALD) in the substrate temperature range of 170-400℃ using Ta(OC_2H_5)_5 and H_2O as precursors. The constant growth rates of 0.42 and 0.47 A per cycle were achieved for the films grown by normal ALD and Photo-ALD, respectively. The increased growth rate in Photo-ALD is probably due to the reactive surface by photon energy and faster surface reaction. In Photo-ALD, however, the constant growth rate started at lower temperature of ~30℃ and one cycle time shortened up to 5.7 s than that of normal ALD. The films grown by normal ALD and Photo-ALD were amorphous and very smooth (0.21-0.35 nm) as examined by X-ray diffractometer and atomic force microscopy, respectively. Also, the refractive index was found to be 2.12-2.16 at the substrate temperature of 190-300℃, similar to that of the film grown by normal ALD. However, the remarkably low leakage current density of 0.6 x 10~(-6) A/cm~2 to 1 x 10~(-6) A/cm~2 at applied field of 1 MV/cm is several order of magnitude smaller than that of normal ALD, probably due to the presence of reactive atom species.
机译:以Ta(OC_2H_5)_5和H_2O为前驱体,在170-400℃的衬底温度范围内,通过光辅助原子层沉积(Photo-ALD)制备了氧化钽薄膜。通过普通ALD和Photo-ALD生长的膜分别获得了每个周期0.42和0.47A的恒定生长速率。 Photo-ALD中增长的速率可能归因于光子能量产生的反应性表面和更快的表面反应。但是,在Photo-ALD中,恒定生长速率始于〜30℃的较低温度,并且一个周期时间比正常ALD缩短了5.7 s。分别通过X射线衍射仪和原子力显微镜检查,通过常规ALD和Photo-ALD生长的膜是无定形的并且非常光滑(0.21-0.35nm)。另外,在190-300℃的基板温度下,折射率为2.12-2.16,与通过常规ALD生长的膜的折射率相似。但是,在1 MV / cm的施加电场下,0.6 x 10〜(-6)A / cm〜2到1 x 10〜(-6)A / cm〜2的极低泄漏电流密度要小几个数量级可能是由于反应性原子的存在,因此比普通的ALD要好。

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