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A combination of electroless and electrochemical etching methods for enhancing the uniformity of porous silicon substrate for light detection application

机译:化学和电化学蚀刻方法的组合,可增强光检测应用中多孔硅基板的均匀性

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This paper reports on a combination of electroless and electrochemical etching of a silicon surface for enhancing the uniformity of fabricated porous silicon substrate and improving the sensitivity of pho-todetectors. Photo-assisted pulsed electrochemical etching of silicon is modified by introducing a novel parameter called delay time (T_d), along with cycle time and pause time, of pulsed current, which can affect the morphology of pores. This technique offers the possibility of growing photoluminescent materials with uniform pores and selective wavelength emission. A sample with a T_d of 2 min shows a significant increase in the intensity of the Raman spectrum (10 times stronger than that of the sample without T_d at 518.2 cm~(-1)) due to the enhanced surface-assisted multi-phonon processes in porous film. A red-shift of 2.5 cm~(-1)and a peak broadening of 1.4 times are also observed for this porous sample compared with those of crystalline silicon. Porous surface properties and the performance of the optimized PS as photodetectors are discussed.
机译:本文报道了对硅表面进行化学和化学蚀刻的组合,以增强所制造的多孔硅基板的均匀性并提高光电探测器的灵敏度。通过引入称为延迟时间(T_d)的新颖参数以及脉冲电流的循环时间和暂停时间来修改硅的光辅助脉冲电化学蚀刻,该参数会影响孔的形态。该技术提供了生长具有均匀孔和选择性波长发射的光致发光材料的可能性。 T_d为2分钟的样品由于增强了表面辅助的多声子过程,拉曼光谱的强度显着增加(比在518.2 cm〜(-1)时没有T_d的样品强10倍)。在多孔膜中。与晶体硅相比,该多孔样品还观察到2.5 cm〜(-1)的红移和1.4倍的峰展宽。讨论了多孔表面性能和优化PS作为光电探测器的性能。

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