机译:机械应力对嵌入标准互补金属氧化物半导体工艺中的Pb(Zr,Ti)O_3薄膜铁电电容器的影响
Analog Technology Development, Texas Instruments, Dallas, Texas 75243, USA, University of Florida, Gainesville, Florida 32611, USA;
Analog Technology Development, Texas Instruments, Dallas, Texas 75243, USA;
Department of Electrical and Computer Engineering, University of Florida, Gainesville, Florida 32611, USA;
机译:退火温度对金属铁电(PbZr_(0.53)Ti_(0.47)O_3)-绝缘体(ZrO_2)-半导体(MFIS)薄膜电容器的电性能的影响
机译:Pb(Zr_(0.6)Ti_(0.4))O_3薄膜电容器铁电性能的厚度依赖性研究
机译:可靠的Pb(Ti,Zr)O_3薄膜电容器的形成,可对铁电非易失性存储器进行读/写耐久性
机译:用于1T / 1C铁电RAM的PB(ZR,TI)O_3铁电电容器的优化工艺和表征
机译:压电瘤应用Pb(Zr0.3Ti0.7)O3薄膜对缩放效应对缩放效应的影响
机译:缩回:将类似外延的Pb(ZrTi)O3薄膜集成到硅中用于下一代铁电场效应晶体管
机译:带有Pt Ox电极的Pb(Zr0.4 Ti 0.6)O3薄膜电容器的铁电性能增强
机译:pb(Zr(sub 1-x)Ti(sub x))O(sub 3)(pZT)和srBi(sub 2)Ta(sub 2)O(sub 9)sBT铁电薄膜中氢诱导降解过程的研究基于电容器