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Analog ASIC for improved temperature drift compensation of a high sensitive porous silicon pressure sensor

机译:模拟ASIC可改善高灵敏度多孔硅压力传感器的温度漂移补偿

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The paper focuses on the design of a CMOS analog ASIC for temperature-drift compensation of a high sensitivity piezoresistive micro-machined porous silicon pressure sensor to avoid analog-to-digital conversion, limit chip area and reduce power consumption. For implementing the compensation circuitry, multilayered perceptron (MLP) based artificial neural network (ANN) with inverse delayed function model of neuron has been optimized. The temperature drift compensation CMOS ASIC has been implemented to make porous silicon pressure sensor an excellent SMART porous silicon pressure sensor. Using the compensation circuit, the error in temperature-drift has been minimized from 93% to about 0.5% as compared to 3% using conventional neuron model in the temperature range of 25–80°C. The entire circuit has been designed using 0.35 μm AMS technology model and simulated using mentor graphics ELDO Simulator.
机译:本文重点研究用于高灵敏度压阻微加工多孔硅压力传感器的温度漂移补偿的CMOS模拟ASIC的设计,以避免模数转换,限制芯片面积并降低功耗。为了实现补偿电路,已经优化了基于多层感知器(MLP)的具有神经元逆延迟功能模型的人工神经网络(ANN)。已经实现了温度漂移补偿CMOS ASIC,以使多孔硅压力传感器成为出色的SMART多孔硅压力传感器。使用补偿电路,将温度漂移的误差从93%最小化至约0.5%,而在25-80°C的温度范围内,使用常规神经元模型时的误差为3%。整个电路使用0.35μmAMS技术模型进行设计,并使用指导者图形ELDO Simulator进行仿真。

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