单向过载传感器厚膜混合集成电路

摘要

Sensor and signal regulating circuit is carried out through hybrid packaging by making use of thick-film circuit technology,which realizes integration and minimization of sensor.%将传感器与信号调节电路利用厚膜电路工艺进行混合封装，完成了传感器的一体化，实现了传感器的小型化。