首页> 外国专利> THICK FILM RESISTOR AND THICK FILM PRINTED WIRING BOARD AND THEIR MANUFACTURE AND THICK FILM HYBRID INTEGRATED CIRCUIT BOARD

THICK FILM RESISTOR AND THICK FILM PRINTED WIRING BOARD AND THEIR MANUFACTURE AND THICK FILM HYBRID INTEGRATED CIRCUIT BOARD

机译:厚膜电阻器和厚膜印刷线路板及其制造和厚膜混合集成电路板

摘要

PURPOSE: To materialize a thick resistor excellent in moisture resistance by constituting it such that the exposed part of a conductor film has a crystalline glass film being made the electrode of a resistor, that a resistor film overlaps the crystalline glass film around the electrode partially and covers the section which includes the electrode so that it may not be exposed. ;CONSTITUTION: Conductor films 2a and 2b, which are made on an insulating board 1, are covered with crystalline glass boards 8a and 8b so that only the parts mounting pat part and the terminal connection may be exposed. A resistor film 3 is made on an electrode. The resistor film 3 are so made protruding out of the electrode both in length and in width, and cover the electrode completely Hereby, the insulation resistance between the conductor films can be prevented from deteriorating, and the moisture resistance can be improved. Accordingly, the manufacturing cost of a thick hybrid integrated circuit board can be cut down.;COPYRIGHT: (C)1993,JPO&Japio
机译:用途:通过将导体膜的裸露部分制成结晶玻璃膜作为电阻器的电极,以制造耐湿性优异的厚电阻器,使电阻器膜与电极周围的结晶玻璃膜部分重叠且覆盖包括电极的部分,以免暴露。组成:在绝缘板1上制成的导体膜2a和2b覆盖有结晶玻璃板8a和8b,以便仅露出安装端子和端子的连接部分。在电极上形成电阻膜3。这样使电阻膜3在长度和宽度上都突出于电极,并完全覆盖电极。由此,可以防止导体膜之间的绝缘电阻劣化,并且可以提高耐湿性。因此,可以降低厚混合集成电路板的制造成本。;版权所有:(C)1993,日本特许厅&日本apio

著录项

  • 公开/公告号JPH053380A

    专利类型

  • 公开/公告日1993-01-08

    原文格式PDF

  • 申请/专利权人 NEC CORP;

    申请/专利号JP19910153653

  • 发明设计人 YAMASHITA YOSHIATSU;NISHIKAWA TOSHIAKI;

    申请日1991-06-26

  • 分类号H05K1/16;H01C1/14;H01C7/00;H01L27/01;H05K3/28;

  • 国家 JP

  • 入库时间 2022-08-22 05:12:48

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