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MANUFACTURE OF PRINTED CIRCUIT BOARD HAVING POLYMERIC THICK-FILM RESISTOR AND METAL THIN-FILM RESISTOR

机译:具有聚合物厚膜电阻器和金属薄膜电阻器的印刷电路板的制造

摘要

PROBLEM TO BE SOLVED: To provide a method capable of accurately controlling the geometrical structure and thickness of resistors, in a manufacturing method of a printed circuit board having a plurality of polymeric thick-film resistors and metal thin-film resistors, whose resistance values are equal or different on the same layer of a printed circuit board.;SOLUTION: A photoresist layer 14 is deposited on a printed circuit board 10. Aperture parts 16a, 16b are formed in the photoresist layer 14. Thereby previously selected regions for forming resistors are exposed. The aperture parts are filled with a plurality of kinds of polymeric thick-film resistive paste 18 whose resistance value is equal or different and resistive metal films. By the above processes, polymeric thick-film resistors and metal thin-film resistors are formed on the printed circuit board 10.;COPYRIGHT: (C)2000,JPO
机译:解决的问题:在具有多个聚合物厚膜电阻器和金属薄膜电阻器的印刷电路板的制造方法中,提供一种能够精确地控制电阻器的几何结构和厚度的方法,所述多个聚合物厚膜电阻器和金属薄膜电阻器的电阻值为在印刷电路板的同一层上相同或不同。;解决方案:在印刷电路板10上沉积光刻胶层14。在光刻胶层14中形成孔口部分16a,16b。裸露。开口部分填充有电阻值相等或不同的多种聚合物厚膜电阻膏18和电阻金属膜。通过上述过程,在印刷电路板10上形成聚合物厚膜电阻器和金属薄膜电阻器。;版权所有:(C)2000,JPO

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