TECHNOLOGY AND FABRIC AT ION SUPPORT FOR THICK FILM MICROELECTRONICS AND PRINTED WIRING BOARDS

摘要

The objective of this contract was to provide technical and fabrication services in the areas of thick film hybrid microelectronics and printed wiring boards with the majority of the technical work to be performed in the thick film hybrid area.nPotential applications for hybrid microelectronics in Army Missiles were to be evaluated and sample hardware designed, fabricated and tested Of particular interest was the design approaches, processing methods and fabrication techniques. The application selected by the IBM and MICOM Techhnical Coordinators to be the prime demonstration vehicle was the THAD Six Inch Missile Autopilot. The specific objectives with respect to this technology evaluation were to design, fabricate and evaluate hybrid modules to perform the circuit functions of the existing discrete design and to design a multilayer printed wiring board and third level package to the point that the overall impact of the hybrid microelectronics packaging approach could be compared with the discrete design at the Autopilot subassembly level.