基于直列式交错微电极阵列的细胞电融合

摘要

An interdigital microelectrode array based cell electrofusion chip is presented. COMSOL Multiphysics software is used to study the effect of the geometry of microelectrodes on the electric field. Based on these results, an optimized microelectrode structure is given. A straight-line microchannel with high intensity microelectrodes is fabricated on the low-resistance layer of a Sol wafer. Experimental results show that the straight-line structure can avoid the cell trapping at the corner of microchannel network. Cell alignment and electrofusion is carried out on this chip,and it has high fusion efficiency.%提出了一种基于交错式齿状微电极阵列的微流控细胞电融合芯片.利用COMSOL Multiphysics 仿真软件,对电场强度有重要影响的微电极几何参数进行了仿真分析,并由此提出了优化的微电极阵列结构.选择SoI硅片的顶层低阻硅加工获得了微电极阵列.实验结果表明:该芯片中采用的直列式微通道结构避免了原有芯片存在的转角易堵塞问题.芯片能够在低电压条件下实现细胞排队和融合过程,具有较高的融合效率.