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A cell electrofusion microfluidic device integrated with 3D thin-film microelectrode arrays

机译:与3D薄膜微电极阵列集成的细胞电融合微流体装置

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摘要

A microfluidic device integrated with 3D thin film microelectrode arrays wrapped around serpentine-shaped microchannel walls has been designed, fabricated and tested for cell electrofusion. Each microelectrode array has 1015 discrete microelectrodes patterned on each side wall, and the adjacent microelectrodes are separated by coplanar dielectric channel wall. The device was tested to electrofuse K562 cells under a relatively low voltage. Under an AC electric field applied between the pair of the microelectrode arrays, cells are paired at the edge of each discrete microelectrode due to the induced positive dielectrophoresis. Subsequently, electric pulse signals are sequentially applied between the microelectrode arrays to induce electroporation and electrofusion. Compared to the design with thin film microelectrode arrays deposited at the bottom of the side walls, the 3D thin film microelectrode array could induce electroporation and electrofusion under a lower voltage. The staggered electrode arrays on opposing side walls induce inhomogeneous electric field distribution, which could avoid multi-cell fusion. The alignment and pairing efficiencies of K562 cells in this device were 99% and 70.7%, respectively. The electric pulse of low voltage (∼9 V) could induce electrofusion of these cells, and the fusion efficiency was about 43.1% of total cells loaded into the device, which is much higher than that of the convectional and most existing microfluidics-based electrofusion devices.
机译:已经设计,制造并测试了将3D薄膜微电极阵列包裹在蛇形微通道壁上的微流控设备,以进行细胞电融合。每个微电极阵列具有在每个侧壁上构图的1015个离散微电极,并且相邻的微电极被共面的电介质通道壁隔开。该设备经过测试,可以在相对较低的电压下对K562细胞进行电熔。在施加在一对微电极阵列之间的交流电场下,由于诱导的正介电电泳,细胞在每个离散微电极的边缘成对。随后,在微电极阵列之间顺序施加电脉冲信号以引起电穿孔和电融合。与在侧壁底部沉积薄膜微电极阵列的设计相比,3D薄膜微电极阵列可以在较低的电压下诱导电穿孔和电融合。相对侧壁上的交错电极阵列会引起不均匀的电场分布,这可以避免多细胞融合。该设备中K562细胞的排列效率和配对效率分别为99%和70.7%。低压(〜9 V)的电脉冲可以诱导这些细胞的电融合,融合效率约为装入该设备的总细胞的43.1%,远高于对流和大多数现有的基于微流体的电融合设备。

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