世界覆铜板新产品新技术赏析(Ⅶ)——松下电工低CTE高可靠良好加工性R-1755V

摘要

文章介绍了松下电工PCB基板材料的发展战略,综述了R-1755V的诸多性能,R-1755V具有低热膨胀、高可靠性和良好加工性,应用于网络设备、测量仪器和汽车领域.%In the paper, development stratagem of PCB substrate material of Matsushita Electric Works, Ltd. was introduced a great deal of performance included low coefficient of thermal expansion, high reliability, good PCB process of R-1755V were reviewed. R-1755V is used in network equipment, measuring instruments and automotive.