考虑PCBA翘曲失效的回流焊工艺制程分析

摘要

针对印制电路板组件(PCBA)在回流焊工艺中的主要失效形式翘曲失效,应用虚拟实验技术进行PCBA回流焊工艺仿真,研究PCBA翘曲失效及其影响因素;基于ANSYS软件建立了回流焊虚拟实验平台,模拟PCBA的回流焊工艺流程,并对其温度场与位移场进行分析,确定PCBA在回流焊工艺中的受热变化规律,进而计算PCBA翘曲度,并分析各影响因素的对翘曲度的影响程度;研究结果表明:PCBA翘曲量随PCBA热膨胀系数、温区7温度的增大而增大,随印制电路板(PCB)厚度、传输带速的增加而减小.%During the re-flow prgcess for PCBA manufacturing,the main failure mode is warpage.To investigate this issue,application of virtual experiment technology was used for PCBA re-flow process simulation.Then study was carried out for PCBA warping failure and its influencing factors.Firstly,virtual experiment platform for re-flow process was set up based on ANSYS software so as to simulate the manufacturing process.Then the temperature field and the displacement field were studied to determine PCBA's thermal variation and main factors in the re-flow process.Further,the warpage of PCBA was calculated.The results show that the warpage increases with the increases of PCBA thermal expansion coefficient and temperature of the 7th zone.While the warpage goes down with the increases of PCB thickness and the transmission belt speed.