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Three-dimensional board warp analysis system, three-dimensional board warp analysis device, three-dimensional board warp analysis method and program
Three-dimensional board warp analysis system, three-dimensional board warp analysis device, three-dimensional board warp analysis method and program
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机译:三维板翘曲分析系统,三维板翘曲分析装置,三维板翘曲分析方法及程序
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摘要
Provided is highly accurate three-dimensional board warp analysis technology that can optimize at a development design phase material quality, size, reflow heating profile, or the like of a printed wiring board and various kinds of electronic components mounted on the board. The invention is characterized in comprising a model making-out means that adds a characteristic value of a material to shape data indicative of a shape of board to make out model data, a model division means that carries out vertical and lateral divisions equally base on the model data, a calculation means that calculates warp of cutting plane and a counter sectional plane of each of the divided models, and a conversion means that connects the cutting planes with each other after the calculation and converts them into warp data on the entire coordinate system.
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