Provided is highly accurate three-dimensional board warp analysis technology that can optimize at a development design phase material quality, size, reflow heating profile, or the like of a printed wiring board and various kinds of electronic components mounted on the board. The invention is characterized in comprising a model making-out means that adds a characteristic value of a material to shape data indicative of a shape of board to make out model data, a model division means that carries out vertical and lateral divisions equally base on the model data, a calculation means that calculates warp of cutting plane and a counter sectional plane of each of the divided models, and a conversion means that connects the cutting planes with each other after the calculation and converts them into warp data on the entire coordinate system.
展开▼
