射频功率晶体管内匹配技术中键合线的建模仿真与参数提取

摘要

Metal wire bonding interconnection is the key means in the internal matching technology of RF power transistor. The diameter, length, arch height and space of bond-wires have great impacts on the radio frequency performance of RF power transistor. The three-dimensional electromagnetic simulation software EMDS and RF circuit design software ADS are used to model and extract the radio frequency equivalent parameters of the bond-wire. Then, the relationship between the variation of physical parameters and the radio frequency equivalent parameters of bond-wires are studied. Finally,the corresponding optimal design measures are proposed for the selection of bond-wires in the internal matching technology of RF power transistor.%金属键合线互连是射频大功率晶体管内匹配技术中的关键手段.键合线的直径、长度、拱高和并列键合线间距等物　理参量,均对器件性能有很大影响.采用三维电磁仿真软件EMDS和射频电路设计软件ADS对金属键合线互连进行了建模　仿真和射频等效参数提取,分析了等效参数与键合线各物理参量之间的关系,针对具体的关系特点及内匹配技术中键合线的　选取,给出了相应的优化设计措施.